트랜지스터패키지1 [디스클로저][속보] 인텔, 2030년까지 1조개의 트랜지스터 패키지에 담는다 - 한국외신뉴스(K-NEWS) Last year, Intel said that it would take process leadership away from TSMC and Samsung Foundry by 2025. Right now, TSMC and Samsung are the top two chip foundries in the world both shipping the most cutting-edge chips. Next year, both will be delivering chips manufactured using the 3nm process node. Let's make this as simple as possible. The smaller the process node, the smaller the transistors .. 2022. 12. 5. 이전 1 다음